CHINA

Invitation to the Global Young Scholars Forum of the 2023 Xianglong Mingfeng Science Forum of the Chinese University of Hong Kong, Shenzhen



About the Forum

Long Feng Science Forum is a registered forum brand of Hong Kong Chinese University (Shenzhen). The forum consists of a main forum, a seminar series and a lecture series. The main forum has been successfully held for five sessions so far, attracting a large number of top scientists, outstanding young scholars and industry leaders in various fields to participate, and the response from all walks of life has been enthusiastic. 
 
The “2023 Xianglong Mingfeng Science Forum – Global Young Scholars Forum” will be held in two sessions.There will be an in-person session from 1 to 3 December 2023 and an online session from 8 to 10 December 2023。 This forum focuses on inviting young top-notch talents and academic rising stars with great development potential in various disciplines at home and abroad to share research results and experience through academic reports, discuss hot topics in disciplines, and generate a collision of diverse views. The forum will serve as an important part of the recruitment process to help the introduction and development of high-level talents in the school. 
 
Here, we warmly invite outstanding academic young talents at home and abroad to actively register for the conference, and look forward to your participation! 
 
The Long Feng Science Forum is a registered brand of The Chinese University of Hong Kong, Shenzhen. The Forum consists of Main Forum, Workshop Series, and Seminar Series. The School of Science and Engineering has hosted five main forums, which have attracted a large number of top scientists, outstanding young scholars and industry leaders in various fields and received overwhelming responses. 
 
The “2023 Global Young Scholars’ Forum” will hold two sessions, an onsite session from December 1 to 3 and an online session from December 8 to 10, 2023. The forum will invite young talents and rising stars with high potential in various disciplines at home and abroad to share their research results and experiences through academic reports, discuss the hot spots of the disciplines together, and generate diversified viewpoints to collide. The forum is a crucial part of our faculty recruitment process. It will help the introduction and development of high-level talents in the university. 
 
We are delighted to announce and invite outstanding young academic talents worldwide to apply for the forum and look forward to your participation!

01Application Requirement

1. Have obtained (or will obtain in the next year) a Ph.D. degree from a well-known university at home or abroad; 
 
2. In materials, chemistry, physics, energy science and related interdisciplinary disciplines; Partial differential equations, computational mathematics, financial mathematics, algebra, geometry, topology, financial engineering and related interdisciplinary studies; Circuits and Devices, Computer Vision, Networking, Information Systems and Optimization, Robotics, Information Engineering, Artificial Intelligence, Energy Engineering; Remarkable achievements have been made in the research fields of integrated circuits and optoelectronic chips. 
 
1.Have obtained (or will obtain within a year) a Ph.D. degree from a reputable university at home or abroad. 
 
2.Have made significant achievements in the research fields of Materials, Chemistry, Physics, Energy Science and related interdisciplinary subjects; Partial Differential Equations, Computational Mathematics, Financial Mathematics, Algebra, Geometry, Topology, Financial Engineering and their related interdisciplinary subjects; Circuits and Device, Computer Vision, Network Science, Communication Systems and Optimization, Robotics, Information Engineering, Artificial Intelligence, Energy Engineering; Integrated Circuits, Optoelectronics, etc.

02 Schedule

The forum will be held offline and online, and the specific arrangements are as follows: 
 
Application Deadline:November 15, 2023

Notification Date of Invited Guests:November 20-24, 2023

Offline Venues:December 1-3, 2023It was held on the campus of Hong Kong Chinese University (Shenzhen). 
 
Online Session:December 8-10, 2023Hosted via Zoom 
 
This forum will hold two sessions, onsite and online, with the following specific arrangements. 
 
Deadline for registration: November 15, 2023. 
 
Invited guests will be notified from November 20 to November 24, 2023. 
 
Onsite session: December 1 to 3, 2023, held on the campus of The Chinese University of Hong Kong, Shenzhen. 
 
Online session: December 8 to 10, 2023, held via Zoom.

03Forum Information

The forum consists of four sub-forums, including Physical Science, Mathematics, Electrical and Computer Engineering, and Microelectronics. 
 
Language: English 
 
Venue: Shenzhen, Zoom online meeting 
 
Applicants can choose to participate online or offline, and the Organizing Committee and experts from the School of Science and Engineering will conduct a preliminary screening and review of the applicants, and then send an invitation letter to the qualified talents and clearly notify the participation method. Young scholars who are invited to participate in the conference in person should book their own round-trip air tickets to participate as scheduled. The forum provides accommodation and meals during the conference and international round-trip air tickets during the specified date (within 14 days) (no more than 15,000 yuan in Europe and the United States, no more than 8,000 yuan in the Asia-Pacific region, and no more than 5,000 yuan in China, only for economy class, reimbursement is reimbursed). The relevant reimbursement details will be sent with the invitation letter. 
 
Contact: 
 
Mailbox:longfengforum@cuhk.edu.cn

Phone: +86-755-842 73833   
 
There will be four sub-forums, including Physical Sciences, Mathematics, Electrical and Computer Engineering and Microelectronics. 
 
Language: English 
 
Venue: Shenzhen, Zoom Meeting 
 
Applicants can choose their preferred method of participation, either onsite or online. After the preliminary screening and review by the forum organizing committee and experts from the School of Science and Engineering, invitation letters will be sent to outstanding candidates who meet the criteria, specifying the method of participation. Young scholars invited to participate onsite need to book round-trip tickets by themselves and attend the forum on time. The forum will provide accommodation and meals during the conference, as well as cover the cost of international round-trip tickets within a specified period (not exceeding 14 days, reimbursement cap for Europe and America is 15000 RMB, for Asia-Pacific 8000 RMB, and for domestic travel 5000 RMB, limited to economy class and reimbursement will be based on actual expenses). Detailed reimbursement guidelines will be sent with the invitation letter. 
 
Contact Us:  
 
E-mail: longfengforum@cuhk.edu.cn

Tel: +86-755-842 73833

04 Talent Support

For more information about job salary, talent subsidies, research funds and supporting support, please refer to our universityPublishedtarget2023Annual Overseas Excellent Talent Project Application Information. Please copy the link below to view the address bar of your browser. 
 
Regarding salary, talent subsidies, research funding, and supporting resources, please refer to the announcement of the 2023 overseas outstanding talent project application information previously released by our university. Please copy the link below and paste it into your browser’s address bar to view.

https://mp.weixin.qq.com/s/iZU4-74I95AQj8SXbHu6_A

2024Specific information on the application of the annual overseas outstanding talent projectTo be notified。 
 
Updated information regarding the 2024 national talent projects will be announced later on. 
 
Starting this year, Shenzhen will provide supporting scientific research funds of about 1.6 million to 4 million yuan for municipal talents. Specific policies for the futureSubject to government documents。 
 
Shenzhen will provide approximately 1.6 to 4 million RMB in research funding for talents at the municipal level. Please refer to government documents for specific policies in the future.

05 Registration

Outstanding young talents at home and abroad are welcome to actively scan the code or click the link below to register. 
 
Please scan the QR code or click the link below to register.

https://wj.cuhk.edu.cn/vm/P689uhX.aspx

Application Deadline:November 15, 2023(Wednesday) 
 
Registration Deadline: November 15, 2023 (Wednesday)

06 School Profile

The School of Science and Engineering of the Chinese University of Hong Kong, Shenzhen is located in Shenzhen, the core city of the Guangdong-Hong Kong-Macao Greater Bay Area. Adhering to the excellent humanistic tradition and strong academic heritage of Chinese University of Hong Kong, the School is committed to cultivating innovative high-level science and engineering talents with international vision, Chinese tradition and social responsibility. 
 
As one of the founding schools of Hong Kong Chinese University (Shenzhen), the School of Science and Engineering has opened 7 undergraduate majors with a development perspective: Materials Science and Engineering, Chemistry, Physics, New Energy Science and Engineering, Electronic and Computer Engineering, Mathematics and Applied Mathematics, and Financial Engineering. 3 master’s programs: Master of Science in Communication Engineering, Master of Science in Artificial Intelligence and Robotics, Master of Science in Supply Chain and Logistics Management; 7 master’s and doctoral programs: Computer and Information Engineering, Materials Science and Engineering, Mathematics, Energy Science and Engineering, Physics, Biomedical Engineering, Chemistry (to be added). With the lofty educational philosophy and perfect academic system of Chinese University of Hong Kong, and with the efforts of a high-quality faculty team from all over the world, it has cultivated outstanding graduates one after another. 
 
School of Science and Engineering is located in Shenzhen, a core city of the Guangdong-Hong Kong-Macao Greater Bay Area. Adhering to the rich CUHK’s academic tradition with high emphasis on humanity elements, the School is committed to nurturing innovative technology leaders embracing China and the world with global visions and social responsibility. 
 
As one of the founding schools of the University, SSE has so far offered 7 Undergraduate Programs: Mathematics and Applied Mathematics, Chemistry, Electrical and Computer Engineering, New Energy Science and Engineering, Materials Science and Engineering, Physics, Financial Engineering. 3 Taught Postgraduate Programs: Communication Engineering, Artificial Intelligence and Robotics,Supply Chain and Logistics Management. 7 Research Postgraduate Programs/Ph.D. programs: Computer and Information Engineering, Materials Science and Engineering, Energy Science and Engineering, Mathematics, Physics, Chemistry (Approval Pending), Biomedical Engineering. Following the lofty educational philosophy and sound academic system of CUHK, SSE and its extraordinary faculty from all over the world have produced a succession of outstanding graduates.  
 
Visit the official website of the college to learn more: 
 
Please visit the School website to learn more:

https://sse.cuhk.edu.cn/

Click on the link below to immerse yourself in the beautiful campus of CUHK-Shenzhen, and we look forward to welcoming you at Chinese University of Hong Kong, Shenzhen! 
 
Click on the “Read More” at the bottom to take a VR Campus Tour. We look forward to welcoming you at The Chinese University of Hong Kong, Shenzhen!

https://www.720yun.com/t/b2vkuqqer8b?scene_id=42010961



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