Miniature supercapacitor modules with high system performance and high integration

Recently, the team of researcher Wu Zhongshuai of the State Key Laboratory of Basic Catalysis of the Dalian Institute of Chemical Physics, Chinese Academy of Sciences (Group 508), the team of researcher Lu Yao of the Single Cell Analysis Research Group (Group 1820), and Academician Cheng Huiming of Shenzhen University of Science and Technology, Chinese Academy of Sciences, Institute of Metal Research, Chinese Academy of Sciences, etc., have developed high-precision lithography, automatic spraying and 3D printing technology, and developed small monolithic integrated miniature supercapacitors with high system performance and high integration.

In order to adapt to the rapid development of miniaturized, wearable and implantable microelectronic devices, it is necessary to develop micro-energy storage devices with small size, high integration, high performance and high compatibility. Planar miniature supercapacitors have important development potential in the field of microelectronics due to their special structure without diaphragm and external metal connection wires, reliable electrochemical performance and easy-to-adjust connection methods. However, due to the lack of reliable preparation of high-precision microelectrode arrays and efficient electrolyte accurate deposition technology, the large-scale fabrication of highly integrated and high-performance microsupercapacitors is still challenging. Therefore, there is an urgent need to develop innovative microfabrication technologies to achieve large-scale and stable fabrication of highly integrated, high-performance, customizable micro supercapacitors.

In this work, the cooperative team developed a general and reliable strategy combining high-precision lithography, automatic spraying and 3D printing technology, realized the large-scale preparation of high-precision microelectrode arrays and accurate and rapid addition of gel electrolytes, and developed an integrated micro supercapacitor module with high area number density, high output voltage and stable performance. The team first used high-precision lithography processing technology and high-stability automatic spraying technology to prepare ultra-small integrated micro supercapacitors, with a single device area of only 0.018cm2 and a device spacing of 600μm, achieving an area device density of 28 per square centimeter, that is, 400 devices in the area of 3.5×4.1cm2. Subsequently, the team designed and developed a gel electrolyte ink with excellent rheological properties, using precise and controllable 3D printing technology to achieve accurate and uniform addition of electrolyte in a very small area, so that a good electrochemical isolation was formed between the microdevices of adjacent units, and the resulting integrated micro supercapacitor can stably output a high voltage of 200V, and the working voltage per unit area reaches 75.6V/cm2, which is the highest value that has been reported for work so far. In addition, the miniature supercapacitor module maintains 92% of its initial capacity after 4000 cycles at an extreme operating voltage of 162V. This work has laid a certain scientific foundation for the development of ultra-small volume and high voltage micro power sources.

The research results, titled “Monolithic integrated micro-supercapacitors with ultrahigh systemic volumetric performance and areal output voltage,” were recently published in the National Science Review. The co-first authors of this work are Wang Sen, a postdoctoral fellow in Group 508, and Li Linmei, a postdoctoral fellow in Group 1820. The above work has been supported by the National Natural Science Foundation of China, the Chinese Academy of Sciences Class A Pilot Special Project “Key Technologies and Demonstration of Transformative Clean Energy”, Dalian High-level Talent Innovation Support Program, China Postdoctoral Science Foundation and other projects. (Source: Dalian Institute of Chemical Physics, Chinese Academy of Sciences)

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